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I-Line Photoresist
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KrF Photoresist
TSV Thick Photoresist
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I-Line Photoresist
당사는 365nm 파장에 대해 필름 두께가 0.1um에서 6.0um인 공정적용을 위한 i-Line Photoresist 제품을 제조합니다. i-Line Photoresist 제품군에서 positive 및 negative type Photoresist를 모두 제조합니다.
프로젝트 개발을 위한 i-Line Photoresist Solution 을 찾고 있는 경우 당사에 문의하면 제품에 대한 보다 구체적인 데이터를 제공하겠습니다.
YCIP-4000E
(Positive PR for 365nm process)
-Target : Thickness 3.5um (Res. 1.5um & 3.0um, 1:1)
-Purpose of use : Implant & Metal Layer
YCIP-1700
(Positive PR for 365nm process)
-Target : Thickness 1.7um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIP-1300
(Positive PR for 365nm process)
-Target : Thickness 1.3um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIP-1100
(Positive PR for 365nm process)
-Target : Thickness 1.1um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIN-2000/YCIN-6000
(Negative PR for 365nm process)
-Target : Thickness 2.0um ~ 6.0um (Bulk Pattern)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIN-1000
(Negative PR for 365nm process)
-Target : Thickness 1.0um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIN-600
(Negative PR for 365nm process)
-Target : Thickness 6.0um (Res. 500nm, 1:1)
-Purpose of use : Implant Layer
YCIN-350
(Negative PR for 365nm process)
-Target : Thickness 0.17um (Res. 500um, 1:1)
-Purpose of use : Passivation Photoresist
YCIN-130
(Negative PR for 365nm process)
-Target : Thickness 0.1um (Res. 1.0um, 1:1)
-Purpose of use : Passivation Photoresist
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