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Semiconductor
All
I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
全部
64
贴文
标题
内容
名称
YEPR Series
Rinsing Solution for EUV photoresist
AYCKP-7930
Positive PR for 248nm process
NTS-300
-Slurry for polishing semiconductor SiO2/Poly/Nitride layer .
-Alternative of selective/non-selective polishing.
ALS-Y957
-Improving the process margin by reducing the cap-leaning after etching
AYCIP-8260
Positive PR for 365nm process
PLECT-100 / PLECT-200
-Target : Prevent collapse & Improvement of LER
-Purpose of use : ArF photoresist
ATL-1008
-Target : Prevent collapse & Improvement of LER
-Purpose of use : KrF photoresist
DY-200
Using the SOD and TSA to accelerate the transition to oxide
CL-Y200
Polysilicone etchant for Quartz tube
YSG-402E
SiGe etchant
DE-Y250L
TMAH type developer for color filter resist
DV-7000D / DE-Y2200 / DV-400 / DV-400S
TMAH type developer
YCTA-9047
-Environmentally safe; PFOS/PFOA issue free
-Low refractive index
-pH controllable
YA-800
(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.08um
-Purpose of use : ArF BARC
YA-600A
(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.06um
-Purpose of use : Gapfill BARC
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