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Semiconductor

AllI-Line PhotoresistBump PhotoresistKrF PhotoresistTSV Thick PhotoresistBARCTARCDeveloperEtchantPromoterRinsing SolutionSpin On Carbon HardmaskCMPWafering
A Total of 3 hit(s)
  • Bump Photoresist
    최근의 발전된 Wafer Level의 패키징, MEMS 및 3D Photolithography 등의 응용 제품의 좁은 피치와 다양한 Topography를 충족하도록 설계된 positive 및 negative Photoresist를 제공하고 있습니다. 구리, 순수 주석 및 니켈을 포함한 다양한 금속의 도금 화학 물질과 호환됩니다.
  • YBNP-S500
    (Negative type Bump Photoresist)
    -Target : Thickness 50um (Res. 75um, Contact Hole)
    -Purpose of use : Negative Bump Photoresist
  • YPP-6000
    (Positive type Bump Photoresist)
    -Target : Thickness 6.0um (Res. 5um, L/S 1:1)
    -Purpose of use : Positive Bump Photoresist
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Company Profile Location R&D Inquiries

HEAD OFFICE, 1st, 2nd, 3rd Factory : 174-12, Yuseori-gil, Seonnam-myeon, Seongju-gun, Gyeongsangbuk-do, South Korea.
T. +82-54-930-2500   F. +82-54-931-8521 4th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX : 49, Seongjusaneopdanji-ro, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea.
T. +82-54-930-2800   F. +82-54-930-2811

2nd R&D Center(Siheung) : 50, Eungyenam-gil, Siheung-si, Gyeonggi-do, Korea
T. +82-31-702-3941 Branch Office(Singapore) : 65 Chulia St, #46 33 OCBC Centre, Singapore 049513
T. +65-6670-6629

Liaison Office(New Jersey U.S.A.) : 460 Bergen Blvd. Suite 262. Palisades Park, New Jersey 07650, USA
T. +1-201-944-0107

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