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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
3
hit(s)
Subject
Contents
Name
Bump Photoresist
최근의 발전된 Wafer Level의 패키징, MEMS 및 3D Photolithography 등의 응용 제품의 좁은 피치와 다양한 Topography를 충족하도록 설계된 positive 및 negative Photoresist를 제공하고 있습니다. 구리, 순수 주석 및 니켈을 포함한 다양한 금속의 도금 화학 물질과 호환됩니다.
YBNP-S500
(Negative type Bump Photoresist)
-Target : Thickness 50um (Res. 75um, Contact Hole)
-Purpose of use : Negative Bump Photoresist
YPP-6000
(Positive type Bump Photoresist)
-Target : Thickness 6.0um (Res. 5um, L/S 1:1)
-Purpose of use : Positive Bump Photoresist
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