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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
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Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
6
hit(s)
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Contents
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KrF Photoresist
당사는 248nm 파장에 대해 필름 두께가 0.30um에서 12.0um인 공정적용을 위한 KrF Photoresist 제품을 제조합니다. KrF Photoresist 제품군에서 Positive와 Negative type Photoresist를 모두 제조합니다.
프로젝트 개발을 위한 KrF Photoresist Solution 을 찾고 있는 경우 당사에 문의하면 제품에 대한 보다 구체적인 데이터를 제공하겠습니다.
YCKN-2954
(Negative PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer
YCKN-4530
(Negative PR for 248nm process)
-Target : Thickness 0.30um (Res. 180nm)
-Purpose of use : Implant Layer
YKN-510
(Negative PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer
YCKP-1654
(Positive PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer
YKP-503
(Positive PR for 248nm process)
-Target : Thickness 0.54um (Res. 180nm, 250nm)
-Purpose of use : Implant & Etch Layer
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