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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
3
hit(s)
Subject
Contents
Name
TSV Thick Photoresist
최신 기술을 포함한 다양한 Packaging Processes를 위한 Photoresist를 개발하고 상용화했습니다. Packaging Processes용 Photoresist는 Wafer Level RDL, TSV를 포함한 광범위한 생산 기술에 사용할 수 있습니다.
AYCKP-9160
-Target : Thickness 6.0um (Res. 5.0um, Contact Hole)
-Purpose of use : KrF Positive TSV Devices
YPP-T6K
(Positive PR TSV)
-Target : Thickness 6.0um (Res. 6.0um, Contact Hole)
-Purpose of use : i-Line Positive TSV Devices
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