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    7. Location
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    1. Semiconductor
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Semiconductor

AllI-Line PhotoresistBump PhotoresistKrF PhotoresistTSV Thick PhotoresistBARCTARCDeveloperEtchantPromoterRinsing SolutionSpin On Carbon HardmaskCMPWafering
A Total of 3 hit(s)
  • TSV Thick Photoresist
    최신 기술을 포함한 다양한 Packaging Processes를 위한 Photoresist를 개발하고 상용화했습니다. Packaging Processes용 Photoresist는 Wafer Level RDL, TSV를 포함한 광범위한 생산 기술에 사용할 수 있습니다.
  • AYCKP-9160
    -Target : Thickness 6.0um (Res. 5.0um, Contact Hole)
    -Purpose of use : KrF Positive TSV Devices
  • YPP-T6K
    (Positive PR TSV)
    -Target : Thickness 6.0um (Res. 6.0um, Contact Hole)
    -Purpose of use : i-Line Positive TSV Devices
이전10페이지이전1페이지1다음1페이지다음10페이지
Company Profile Location R&D Inquiries

HEAD OFFICE, 1st, 2nd, 3rd Factory : 174-12, Yuseori-gil, Seonnam-myeon, Seongju-gun, Gyeongsangbuk-do, South Korea.
T. +82-54-930-2500   F. +82-54-931-8521 4th Factory, SEONGJU GENERAL INDUSTRIAL COMPLEX : 49, Seongjusaneopdanji-ro, Seongju-eup, Seongju-gun, Gyeongsangbuk-do, South Korea.
T. +82-54-930-2800   F. +82-54-930-2811

2nd R&D Center(Siheung) : 50, Eungyenam-gil, Siheung-si, Gyeonggi-do, Korea
T. +82-31-702-3941 Branch Office(Singapore) : 65 Chulia St, #46 33 OCBC Centre, Singapore 049513
T. +65-6670-6629

Liaison Office(New Jersey U.S.A.) : 460 Bergen Blvd. Suite 262. Palisades Park, New Jersey 07650, USA
T. +1-201-944-0107

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