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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
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Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
3
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TSV Thick Photoresist
We have developed and commercialized photoresists for various packaging processes including the latest technology. The photoresists for packaging processes can be used for extensive production technologies such as wafer level RDL and TSV.
AYCKP-9160
-Target : Thickness 6.0um (Res. 5.0um, Contact Hole)
-Purpose of use : KrF Positive TSV Devices
AYCKP-9160
-Target : Thickness 6.0um (Res. 5.0um, Contact Hole)
-Purpose of use : KrF Positive TSV Devices
1
