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Semiconductor
All
I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
64
hit(s)
Subject
Contents
Name
YEPR Series
Rinsing Solution for EUV photoresist
AYCKP-7930
Positive PR for 248nm process
NTS-300
-Slurry for polishing semiconductor SiO2/Poly/Nitride layer .
-Alternative of selective/non-selective polishing.
ALS-Y957
-Improving the process margin by reducing the cap-leaning after etching
AYCIP-8260
Positive PR for 365nm process
PLECT-100 / PLECT-200
-Target : Prevent collapse & Improvement of LER
-Purpose of use : ArF photoresist
ATL-1008
-Target : Prevent collapse & Improvement of LER
-Purpose of use : KrF photoresist
DY-200
Using the SOD and TSA to accelerate the transition to oxide
CL-Y200
Polysilicone etchant for Quartz tube
YSG-402E
SiGe etchant
DE-Y250L
TMAH type developer for color filter resist
DV-7000D / DE-Y2200 / DV-400 / DV-400S
TMAH type developer
YCTA-9047
-Environmentally safe; PFOS/PFOA issue free
-Low refractive index
-pH controllable
YA-800
(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.08um
-Purpose of use : ArF BARC
YA-600A
(Bottom Anti Refective Coating Materials)
-Target : Thickness 0.06um
-Purpose of use : Gapfill BARC
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