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I-Line Photoresist
Bump Photoresist
KrF Photoresist
TSV Thick Photoresist
BARC
TARC
Developer
Etchant
Promoter
Rinsing Solution
Spin On Carbon Hardmask
CMP
Wafering
A Total of
64
hit(s)
Subject
Contents
Name
YCIN-1000
(Negative PR for 365nm process)
-Target : Thickness 1.0um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIN-600
(Negative PR for 365nm process)
-Target : Thickness 6.0um (Res. 500nm, 1:1)
-Purpose of use : Implant Layer
YCIN-350
(Negative PR for 365nm process)
-Target : Thickness 0.17um (Res. 500um, 1:1)
-Purpose of use : Passivation Photoresist
YCIN-130
(Negative PR for 365nm process)
-Target : Thickness 0.1um (Res. 1.0um, 1:1)
-Purpose of use : Passivation Photoresist
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