Semiconductor

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Semiconductor

YCIN-1000

(Negative PR for 365nm process)
-Target : Thickness 1.0um (Res. 500nm, 1:1)
-Purpose of use : Implant & Etch Layer / OLED Devices
YCIN-600

(Negative PR for 365nm process)
-Target : Thickness 6.0um (Res. 500nm, 1:1)
-Purpose of use : Implant Layer
YCIN-350

(Negative PR for 365nm process)
-Target : Thickness 0.17um (Res. 500um, 1:1)
-Purpose of use : Passivation Photoresist
YCIN-130

(Negative PR for 365nm process)
-Target : Thickness 0.1um (Res. 1.0um, 1:1)
-Purpose of use : Passivation Photoresist

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